| PCB生产中热风整平工艺 |
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| 引用本文： | 李雪春. PCB生产中热风整平工艺[J]. 印制电路信息, 2003, 0(9): 45-46 |
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| 作者姓名： | 李雪春 |
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| 作者单位： | 广东江门市奔力达电路有限公司,529000 |
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| 摘 要： | 随着印制电路板对锡面要求越来越高,热风整平对印制电路板生产更显重要。本丈探讨了热风整平工艺及其在生 产过程中的常见故障和成因,从而提高印制电路板的合格率。
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| 关 键 词： | 热风整平 印制电路板 工艺参数 |
| 修稿时间： | 2003-07-02 |
HASL Process in PCB |
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| Li Xuechun. HASL Process in PCB[J]. Printed Circuit Information, 2003, 0(9): 45-46 |
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| Authors: | Li Xuechun |
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| Abstract: | Along with print to make the circuit board more and more high to the request of the tin. The hot preeze is whole usually print the system circuit plank even shows the importance. This text explored to lead hot breeze whole even craft and its in production line of familiar breakdown. With the exaltation prints to make the qualified rate in knothole in electric circuit. |
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| Keywords: | the hot breeze make the circuit board craft parameter |
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