| 用升华法释放表面硅工艺中的悬浮结构 |
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| 引用本文： | 郝一龙,武国英,吴琳,徐嘉佳. 用升华法释放表面硅工艺中的悬浮结构[J]. 微纳电子技术, 2002, 39(9): 22-27 |
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| 作者姓名： | 郝一龙 武国英 吴琳 徐嘉佳 |
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| 作者单位： | 北京大学微电子所,北京,100871 |
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| 摘 要： | 介绍了在谐振器结构释放后的干燥过程中,采用的一种有效的、防粘附的方法———升华法。在升华法的基础上,开发了充分置换升华法,对若干种释放方法进行实验、比较,确定了充分置换法的更优性;并找出了影响分离长度的因素,为提高结构释放产品率奠定了基础。
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| 关 键 词： | 表面工艺 升华法 粘附 |
| 文章编号： | 1671-4776(2002)09-0022-06 |
| 修稿时间： | 2002-06-19 |
Releasing the suspending structure in surface micromachining with the method of sublimation |
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| HAO Yi-long,WU Guo-ying,WU Lin,XU Jia-jia. Releasing the suspending structure in surface micromachining with the method of sublimation[J]. Micronanoelectronic Technology, 2002, 39(9): 22-27 |
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| Authors: | HAO Yi-long WU Guo-ying WU Lin XU Jia-jia |
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| Abstract: | The method of sublimation is first briefly introduced,which has been proved to be ef-ficient in the process of releasing structure without sticking.Through experimentation,adequately-pemuting sublimation method,was developed and was compared with other releasing means by different parameters.Furthermore the factors affectting the length of releasing structure were found,which laid the foundation of improving yield of releasing in MEMS . |
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| Keywords: | surface technology sublimation method sticking |
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