| 无铅Sn—Ag—Sb与Sn—Zn—In润湿性研究 |
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| 引用本文： | 袁宜耀 孙勇 关敏. 无铅Sn—Ag—Sb与Sn—Zn—In润湿性研究[J]. 电子工艺技术, 2007, 28(3): 135-138 |
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| 作者姓名： | 袁宜耀 孙勇 关敏 |
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| 作者单位： | [1]昆明理工大学,云南昆明650093 [2]昆明理工大学云南省新材料制备与加工重点实验室,云南昆明650093 |
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| 基金项目： | 云南省科技攻关项目（项目编号：2002gg-ZB07）. |
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| 摘 要： | 通过实验测定Sn—Ag—Sb及Sn—Zn—In系列合金的润湿角，进行了润湿性研究，发现Sn—Ag—Sb及Sn—Zn—In系焊料存在润湿性差的缺点，通过添加低表面张力的金属或稀土元素可在一定程度上降低润湿角，能提高润湿性。
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| 关 键 词： | 无铅焊料 润湿性 Sn—Ag—Sb Sn—Zn—In |
| 文章编号： | 1001-3474（2007）03-0135-04 |
| 修稿时间： | 2007-04-05 |
Wetting Ability of Sn - Ag - Sb and Sn - Zn - In Lead- free Based Solders |
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| YUAN Yi - yao , SUN Yong, WU Min. Wetting Ability of Sn - Ag - Sb and Sn - Zn - In Lead- free Based Solders[J]. Electronics Process Technology, 2007, 28(3): 135-138 |
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| Authors: | YUAN Yi - yao SUN Yong WU Min |
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| Abstract: | This experiment mensurates the Wetting angle of Sn - Ag - Sb and Sn - Zn - In Lead - free Based Solders. The results indicate that Wetting Ability of Sn - Ag - Sb and Sn - Zn - In lead - free based solders are not very good. But the wetting angle was redused by adding some low surface tension metals or thulium, and this can improve the wetting ability of Sn - Ag - Sb and Sn - Zn - In lead - free based solders. |
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| Keywords: | Lead - free solders Wetting ability Sn - Ag - Sb Sn - Zn - In |
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