| 助焊剂的正确使用和免清洗技术要点 |
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| 引用本文： | 齐成.助焊剂的正确使用和免清洗技术要点[J].印制电路信息,2010(3):60-64. |
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| 作者姓名： | 齐成 |
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| 作者单位： | 福建福州350012 |
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| 摘 要： | 在印制电路板制作中离不开焊锡等焊接工艺，它对印制电路板最终的质量影响极大。为保证焊接工艺的顺利进行，在操作中通常要使用助焊剂。文章主要探讨助焊剂的正确选用和对助焊剂使用中残留物的处理技术，即免清洗技术的操作要点。
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| 关 键 词： | 印制电路板 助焊剂 免清洗技术 |
Key Points of Correct Use of Welding Flux of and Absolution Clean Technique |
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| QI Cheng.Key Points of Correct Use of Welding Flux of and Absolution Clean Technique[J].Printed Circuit Information,2010(3):60-64. |
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| Authors: | QI Cheng |
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| Abstract: | In the printed circuit board manufacturing the process of welding is key to the quality of PCB assembled. To assure good soldering, the welding flux is used. This paper discusses the correct choose and use of welding flux as well as treatment of solder remains, the key points of absolution clean technique. |
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| Keywords: | Printed Circuit Board welding flux absolution clean technique |
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