高速铣削铝衬微波印制板切削温度仿真研究

首先根据高速铣削的特点，用热源法建立了考虑切削深度影响的高速铣削铝衬微波印制板有限元模型；根据有限元模型使用ANSYS对微波印制板的高速铣削温度场进行了数值模拟;并将仿真结果与实验结果进行比较，验证了有限元模型；在此基础上讨论了进给和转速对高速铣削印制板温度场的影响。仿真结果表明：印制板的切削温度随进给速度和主轴转速的增加而增加，转速的影响更为显著，且高速铣削铝衬微波印制板时转速不宜超过16000r／min，否则会导致切削区域温度过高，影响加工质量。

FEM Analysis Cutting Temperature in High-speed Milling Microwave Printed Circuit Board(PCB)

In this paper, a finite element model of the microwave printed circuit board temperature field considering cutting depth （ap） effect is established using the method of heat source in allusion to the machining c, haraeteristic of the HSC at first. Based on the model, FEM simulation research is conducted on the cutting temperature of high-speed milling microwave printed circuit board. The comparison of the results of the finite element simulation and the data of the experiment verifies the accuracy of the finite element model. The relation between cutting temperature and milling parameters（feed speed and rotational speed） is investigated after this. It is found that the cutting temperature increases with the increase of feed speed and rotational speed, with the rotational speed as a key factor. Simulation results show that when choosing the milling parameters, it＇s not suitable to choose a rotational speed with the value below 16000r/ min, or else the cutting temperature of the milling zone would become too high to obtain a good machining quality.