| LED封装的研究现状及发展趋势 |
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| 引用本文： | 汤坤,卓宁泽,施丰华,邢海东,刘光熙,王海波. LED封装的研究现状及发展趋势[J]. 照明工程学报, 2014, 0(1): 26-30 |
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| 作者姓名： | 汤坤 卓宁泽 施丰华 邢海东 刘光熙 王海波 |
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| 作者单位： | [1]南京工业大学材料科学与工程学院,江苏南京210009 [2]南京工业大学电光源材料研究所,江苏南京210015 |
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| 基金项目： | 国家高技术研究发展计划（863计划）（SQ2010AA0323083001）,2013年科技部科研院所专项（2013EG111218）,2013年江苏省科技支撑（工业）计划（BE2012115）. |
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| 摘 要： | LED因其高效化、高功率化、高可靠性和低成本的不断发展，LED封装技术在越发重要的同时面临巨大的挑战。在封装过程中，封装材料和封装结构对LED散热与出光的影响最为关键。本文主要从封装材料（芯片、基板、热界面材料、荧光粉）和封装结构（Lamp、Surface Mounted Devices（SMD）、Chip on Board（CoB）、Remote Phosphor（RP））上，阐述LED封装的研究现状以及发展趋势。
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| 关 键 词： | LED 封装 材料 结构 |
Research Status and Development Trends of LED Packaging |
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| Tang Kun,Zhuo Ningze,Shi Fenghua,Xing Haidong,Guangxi,Wang Haibo. Research Status and Development Trends of LED Packaging[J]. China Illuminating Engineering Journal, 2014, 0(1): 26-30 |
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| Authors: | Tang Kun Zhuo Ningze Shi Fenghua Xing Haidong Guangxi Wang Haibo |
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| Affiliation: | 1. School of Material Science and Engineering Nanjing University of Technology, Nanjing 210009, China; 2. Research Institute of Electron-Light Material NJUT, Nanjing 210015, China) |
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| Abstract: | With the development of efficiency, high power, high reliability and low cost, LED packaging technology becomes more important, while facing enormous challenges. In the process of packaging, materials and structures are key factors in heat dissipation and light extraction. This paper mainly described research status and development trends of LED packaging from materials （chips, substrates, thermal interface materials, phosphors） and structures （Lamp, Surface Mounted Devices （SMD）, Chip on Board （COB）, Remote phosphor （RP））. |
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| Keywords: | LED packaging material structure |
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