| BiAgSbCu系高温无铅钎料制备及焊接性能研究 |
| |
| 引用本文： | 涂文彬,周光雄.BiAgSbCu系高温无铅钎料制备及焊接性能研究[J].电子科技,2013,26(10):91-94. |
| |
| 作者姓名： | 涂文彬 周光雄 |
| |
| 作者单位： | (广东工业大学 材料与能源学院,广东 广州 510006) |
| |
| 摘 要： | 研制开发熔点在260 ℃以上的高温无铅钎料来代替传统的高铅钎料运用于电子封装一直是钎焊领域的一大难题。熔点约为272 ℃的Bi-2.6 Ag-5 Sb钎料合金因润湿性和焊接可靠性不良在运用上受到限制。文中通过在Bi-2.6 Ag-5 Sb钎料合金中添加微量元素Cu来改善B-i2.6 Ag-5 Sb合金的润湿性及焊接可靠性。研究结果表明,Cu含量对BiAgSbCu系钎料合金熔点影响较小,当Cu含量为2 %时,润湿性及焊接可靠性最佳。
|
| 关 键 词： | 高温无铅钎料 润湿性 剪切强度 显微组织 |
BiAgSbCu-based High-temperature Lead-free Solder Preparation and its Welding Performance |
| |
| TU Wenbin
,
ZHOU Guangxiong.BiAgSbCu-based High-temperature Lead-free Solder Preparation and its Welding Performance[J].Electronic Science and Technology,2013,26(10):91-94. |
| |
| Authors: | TU Wenbin ZHOU Guangxiong |
| |
| Affiliation: | (School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China) |
| |
| Abstract: | The development of high melting temperature lead-free solder with melting point above 260 ℃ to replace the traditional high lead solder used for electronic packaging has been a major difficulty in the field of soldering.Bi-2.6 Ag-5 Sb solder alloy whose melting point is 272 ℃ is restricted because of its inferior wettability and soldering reliability.In this paper,Cu is added into Bi-2.6 Ag-5 Sb solder alloy to improve the wettability and soldering reliability.The results show that there is no obvious change in the melting points of BiAgSbCu solder alloy with the addition of Cu,while the wettability and soldering reliability of BiAgSbCu solder alloy improve remarkably with the addition of 2%Cu. |
| |
| Keywords: | high melting temperature lead-free solder wettability shear strength microstructural |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
| 点击此处可从《电子科技》浏览原始摘要信息 |
|
点击此处可从《电子科技》下载全文 |
