| 高速多层PCB板中过孔的建模、仿真及分析 |
| |
| 引用本文： | 王永军,王俊鸣.高速多层PCB板中过孔的建模、仿真及分析[J].电子科技,2013,26(9):41-43. |
| |
| 作者姓名： | 王永军 王俊鸣 |
| |
| 作者单位： | (1.西安电子科技大学 电子工程学院,陕西 西安 710071;2.中国人民解放军 空军驻无锡地区军事代表室,江苏 无锡 214063) |
| |
| 摘 要： | 利用Hyperlynx软件对高速PCB板中所应用到的过孔进行建模与仿真,分析了过孔对流经其上信号的影响,并给出了改进、优化过孔的方法。仿真结果表明,在要求线上信号完整性高的情况下,使用过孔方式连接的电路得到了改善和优化。
|
| 关 键 词： | Hyperlynx PCB 过孔 |
Modeling, Simulation and Analysis of Via in High-speed Multilayer PCB |
| |
| WANG Yongjun
,
WANG Junming.Modeling, Simulation and Analysis of Via in High-speed Multilayer PCB[J].Electronic Science and Technology,2013,26(9):41-43. |
| |
| Authors: | WANG Yongjun WANG Junming |
| |
| Affiliation: | (1.School of Electronic Engineering,Xidian University,Xi'an 710071,China;2.Wuxi Air Force Military Representative Office,PLA,Wuxi 214063,China) |
| |
| Abstract: | High-speed PCB board vias modeling and simulation are made using Hyperlynx software to analyze the influence of the vias on the signals running through them,and an improved and optimized via hole method is proposed.Simulation results show that in the case of requirement of a high line signal integrity,circuits using via holes connection are improved and optimized. |
| |
| Keywords: | Hyperlynx PCB via |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
| 点击此处可从《电子科技》浏览原始摘要信息 |
|
点击此处可从《电子科技》下载全文 |
|
