In‐Plane Micro‐Supercapacitors for an Integrated Device on One Piece of Paper |
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Authors: | Ruisheng Guo Jiangtao Chen Bingjun Yang Lingyang Liu Lijun Su Baoshou Shen Xingbin Yan |
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Affiliation: | 1. Laboratory of Clean Energy Chemistry and Materials, State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese of Academy of Sciences, Lanzhou, P. R. China;2. University of Chinese Academy of Sciences, Beijing, P. R. China |
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Abstract: | Portable and wearable sensors have attracted considerable attention in the healthcare field because they can be worn or implanted into a human body to monitor environmental information. However, sensors cannot work independently and require power. Flexible in‐plane micro‐supercapacitor (MSC) is a suitable power device that can be integrated with sensors on a single chip. Meanwhile, paper is an ideal flexible substrate because it is cheap and disposable and has a porous and rough surface that enhances interface adhesion with electronic devices. In this study, a new strategy to integrate MSCs, which have excellent electrochemical and mechanical performances, with sensors on a single piece of paper is proposed. The integration is achieved by printing Ni circuit on paper without using a precoating underlay. Ink diffusion is also addressed to some degree. Meanwhile, a UV sensor is integrated on a single paper, and the as‐integrated device shows good sensing and self‐powering capabilities. MSCs can also be integrated with a gas sensor on one‐piece paper and can be charged by connecting it to a solar cell. Thus, it is potentially feasible that a flexible paper can be used for integrating MSCs with solar cell and various sensors to generate, store, and use energy. |
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Keywords: | flexible electronics integrated devices paper‐based electronics sensors supercapacitors |
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