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Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal,Template‐Fabricated Microporous Copper |
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| Authors: | James W Palko Hyoungsoon Lee Chi Zhang Tom J Dusseault Tanmoy Maitra Yoonjin Won Damena D Agonafer Jess Moss Farzad Houshmand Guoguang Rong Joshua D Wilbur Derrick Rockosi Ihor Mykyta Dan Resler David Altman Mehdi Asheghi Juan G Santiago Kenneth E Goodson |
| Affiliation: | 1. Department of Mechanical Engineering, Stanford University, Stanford, CA, 94305, USA;2. Department of Mechanical Engineering, University of California Merced, Merced, CA, 95340, USA;3. School of Mechanical Engineering, Chung‐Ang University, Seoul, South Korea;4. Department of Mechanical and Aerospace Engineering, University of California Irvine, Irvine, CA, USA;5. Department of Mechanical Engineering and Materials Science, Washington University, St. Louis, MO, USA;6. Electronics and Communication Engineering Department, Suzhou Vocational Institute of Industrial Technology, Suzhou, China;7. Advanced Technology Programs, Raytheon Integrated Defense Systems, Sudbury, MA, USA |
| Abstract: | This paper reports the first integration of laser‐etched polycrystalline diamond microchannels with template‐fabricated microporous copper for extreme convective boiling in a composite heat sink for power electronics and energy conversion. Diamond offers the highest thermal conductivity near room temperature, and enables aggressive heat spreading along triangular channel walls with 1:1 aspect ratio. Conformally coated porous copper with thickness 25 µm and 5 µm pore size optimizes fluid and heat transport for convective boiling within the diamond channels. Data reported here include 1280 W cm?2 of heat removal from 0.7 cm2 surface area with temperature rise beyond fluid saturation less than 21 K, corresponding to 6.3 × 105 W m?2 K?1. This heat sink has the potential to dissipate much larger localized heat loads with small temperature nonuniformity (5 kW cm?2 over 200 µm × 200 µm with <3 K temperature difference). A microfluidic manifold assures uniform distribution of liquid over the heat sink surface with negligible pumping power requirements (e.g., <1.4 × 10?4 of the thermal power dissipated). This breakthrough integration of functional materials and the resulting experimental data set a very high bar for microfluidic heat removal. |
| Keywords: | boiling diamond laser ablation porous copper templated electrodeposition |