| Affiliation: | 1. Institute of Functional Nano and Soft Materials (FUNSOM), Collaborative Innovation Center of Suzhou Nanoscience and Technology, Soochow University, Suzhou, China;2. Department of Electrical Engineering and Computer Sciences, Massachusetts Institute of Technology, Cambridge, MA, USA;3. Department of Materials Science and Engineering, Stanford University, CA, 94305, USA;4. Rowland Institute, Harvard University, Cambridge, MA, USA;5. State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China;6. DISMI, Università di Modena e Reggio Emilia, Reggio Emilia, Italy;7. Electronic Engineering Department, Universitat Autonoma de Barcelona, Cerdanyola del Vallés, Spain;8. Forschungszentrum Jülich GmbH, Jülich, Germany |
