| 从日本专利看PCB基板材料制造技术的新发展之六——埋入电容基板用高ε覆铜板的技术进展 |
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| 引用本文： | 祝大同. 从日本专利看PCB基板材料制造技术的新发展之六——埋入电容基板用高ε覆铜板的技术进展[J]. 印制电路信息, 2004, 0(12): 7-12 |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 北京远创铜箔设备有限公司,100027 |
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| 摘 要： | 本连载文章,以近一两年发表的日本专利为对象,研究、综述了日本PCB基板材料业在制造技术上的新发展。本篇主要围绕着有关埋入电容基板用高ε覆铜板技术开发的主题。
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| 关 键 词： | 印制电路板 埋入电容 高介电常数覆铜板 |
The Technique Progress of High-εCCL for the PCB with Capacitors--The Newest Development of Manufacturing Technology about PCB Substrate according to Japanese Patent(6) |
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| Zhu Datong. The Technique Progress of High-εCCL for the PCB with Capacitors--The Newest Development of Manufacturing Technology about PCB Substrate according to Japanese Patent(6)[J]. Printed Circuit Information, 2004, 0(12): 7-12 |
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| Authors: | Zhu Datong |
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| Abstract: | The newest development of manufacturing technology about PCB substrate was reviewed according toJapanese patent in recent two years in the serve paper. This article had summarized the technology about the develop-ment of high-e CCL for the PCB with capacitors. |
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| Keywords: | printed circuit board embedded capacitor high-dielectric constant CCL |
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