首页 | 本学科首页   官方微博 | 高级检索  
     


Microstructure and strength of diffusion-bonded joints of TiAl base alloy to steel
Authors:P He  J C Feng  B G Zhang  Y Y Qian
Affiliation:

National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, People's Republic of China

Abstract:Diffusion bonding of TiAl-based alloy to steel was carried out at 850–1100 °C for 1–60 min under a pressure of 5–40 MPa in this paper. The relationship of the bond parameters and tensile strength of the joints was discussed, and the optimum bond parameters were obtained. When products are diffusion-bonded, the optimum bond parameters are as follows: bonding temperature is 930–960 °C, bonding pressure is 20–25 MPa, bonding time is 5–6 min. The maximum tensile strength of the joint is 170–185 MPa. The reaction products and the interface structures of the joints were investigated by scanning electron microscopy (SEM), electron probe X-ray microanalysis (EPMA) and X-ray diffraction (XRD). Three kinds of reaction products were observed to have formed during the diffusion bonding of TiAl-based alloy to steel, namely Ti3Al+FeAl+FeAl2 intermetallic compounds formed close to the TiAl-based alloy. A decarbonised layer formed close to the steel and a face-centered cubic TiC formed in the middle. The interface structure of diffusion-bonded TiAl/steel joints is TiAl/Ti3Al+FeAl+FeAl2/TiC/decarbonised layer/steel, and this structure will not change with bond time once it forms. The formation of the intermetallic compounds results in the embrittlement of the joint and poor joint properties. The thickness of each reaction layer increases with bonding time according to a parabolic law. The activation energy Q and the growth velocity K0 of the reacting layer Ti3Al+FeAl+FeAl2+TiC in the diffusion-bonded joints of TiAl base alloy to steel are 203 kJ/mol and 6.07 mm2/s, respectively. Careful control of the growth of the reacting layer Ti3Al+FeAl+FeAl2+TiC can influence the final joint strength.
Keywords:Diffusion bonding  Microstructure  TiAl base alloy
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号