| 微流控芯片超声振动注射成型模具设计 |
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| 引用本文： | 李常峰,蒋炳炎,申瑞霞,侯文潭.微流控芯片超声振动注射成型模具设计[J].工程塑料应用,2010,38(2). |
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| 作者姓名： | 李常峰 蒋炳炎 申瑞霞 侯文潭 |
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| 作者单位： | 中南大学机电工程学院现代复杂装备设计与极端制造教育部重点实验室,长沙,410083 |
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| 基金项目： | 国家高技术研究发展计划(863)项目，教育部科学技术研究重点资助项目 |
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| 摘 要： | 针对目前微流控芯片注射成型中微通道充填困难、成型精度低等问题,研究超声振动辅助注射成型微流控芯片的方法,设计出微流控芯片超声振动模具。创新性地引入热流道系统,实现了超声振动系统与注射成型模具的有效集成;独特的流道和型腔布置实现了芯片的基片和盖片同模同时成型;改进的二次顶出机构实现了芯片的无损脱模。
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| 关 键 词： | 超声振动 微流控芯片 注射成型 无损脱模 |
DESIGN OF ULTRASONIC VIBRATION ASSISTED INJECTION MOLD FOR MICROFLUIDIC CHIP |
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| Li Changfeng,Jiang Bingyan,Shen Ruixia,Hou Wentan.DESIGN OF ULTRASONIC VIBRATION ASSISTED INJECTION MOLD FOR MICROFLUIDIC CHIP[J].Engineering Plastics Application,2010,38(2). |
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| Authors: | Li Changfeng Jiang Bingyan Shen Ruixia Hou Wentan |
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| Abstract: | Aiming at existing problems of injection molding of microfluidic chip, such as filling difficulty and low molding accuracy of microchannel, the method of ultrasonic vibration assisted injection molding of microfluidic chip was studied, and an ultrasonic vibration assisted injection mold for microfluidic chip was designed. The ultrasonic vibration system and injection mold were integrated effectively by introducing hot runner system innovatively. The unique disposal of runner system and cavity enabled the molding of substrate and coverslip simultaneously in a single mold. The nondestructive demoulding of microfluidic chip was achieved by using an improved secondary demoulding device. |
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| Keywords: | ultrasonic vibration microfluidic chip injection molding nondestructive demoulding |
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