集成两路射频SiP发射器的设计和研究

随着移动通信和其它电子应用领域的不断进步,系统集成需求日益紧迫。除了可以应对系统性能、功能、成本和小型化的更高要求,系统级封装(SiP)在降低开发成本、实施灵活设计、缩短开发周期,和集成异质芯片上也有突出优势。这篇文章介绍了一个可用于手机基站系统的双通路发射系统SiP模块的开发。我们用计算模拟方法辅助优化设计,并成功制造和验证了SiP模块。SiP为内嵌电磁干扰屏蔽罩的12mmx12mmx1.9mm的多层栅格阵列封装(LGA)。各种射频信号性能均通过测试,包括严格的隔离度要求。电磁屏蔽测试和计算模拟结果高度吻合。最后,文章介绍了一种高效的计算模拟方法,极大地缩短了计算模拟的时间,并对未来射频SiP开发将提供有力帮助。

Design and Characterization of a Two-Channel Transmitter SiP Module

With the advance of electronic applications in mobile, communication, and other areas, high level system integration is highly desired for better performance, functionality, cost effectiveness, and miniaturization. Package level system integration （ System-in-Package or SiP ） provides additional benefits in lower development cost, design flexibility, shorter development cycle, and the ability to combine heterogeneous chips within a package configuration, etc. In this paper, a two-channel transmitter SiP module development work is presented. This SiP module can be applied in a mobile base station system. With a simulation aided design approach, the complex SiP module is designed, fabricated and verified in a single design cycle. The SiP is a 12mm×12mm×1.9mm LGA package, with an embedded metal can for EMI shielding purpose. With carefully designed test setup, this SiP module has been tested for various RF signal performances, and all the stringent performance requirements have been met, including the most challenging isolation requirement. Isolation between the output ports of the two channels are measured, and compared with simulated results. It is concluded that the simulated results and measured data are in excellent agreement. Finally, a very efficient simulation method is proposed, which greatly reduces simulation time for a complicated 3D model and 〈＇an l〉e used for fillure RF SiP module development.