湿法贴膜技术与精细线路制作

随着减成法在PCB制作中的日益广泛使用和精细化线路发展的要求,提高良率和线路质量越来越重要。本文结合几年来湿法贴膜技术在蚀刻制程中广泛应用的经验,进一步总结了湿法贴膜技术的特点和作用机理,就湿法贴膜对板面凹陷和铜瘤的填充和包埋机理及湿法贴膜的优点做进一步的探讨,主要目的是为精细线路制作提供借鉴。在文章的最后,介绍了简便的结合力验证方法以供同行参考。

Fine Line Manufacturing and Wet Lamination Technology

As the wide application of the subtractive process in the PCB manufacturing, especially in the fine line and HDI fabrication, it becomes more important to improve the yield rate and the line quality . This paper combine the experiences with wet laimnation in the past ,refine and conclude the wet lamination advantage and the mechanism, which emphasize the update principle of wet lamination on the dent, scratch and copper nodule .The goal is to provide the footstone for the fine line manufacturing. At the end of this paper, we simply introduce the inspection for the dry film conformation and adhesion.