| 电子封装用免清洗助焊剂的研究进展 |
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| 引用本文： | 刘月,丁运虎,毛祖国,黄兴林,王柱元,黄朝志. 电子封装用免清洗助焊剂的研究进展[J]. 电镀与精饰, 2017, 39(6). DOI: 10.3969/j.issn.1001-3849.2017.06.004 |
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| 作者姓名： | 刘月 丁运虎 毛祖国 黄兴林 王柱元 黄朝志 |
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| 作者单位： | 武汉材料保护研究所,湖北武汉,430030 |
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| 摘 要： | 介绍了助焊剂的作用及其分类;总结了免清洗助焊剂的特点、种类和检测方法,介绍了几种新型免清洗助焊剂及其研究进展;对免清洗助焊剂的成分如活化剂、溶剂、表面活性剂和添加剂的功效做了说明,指出了存在的一些问题,并展望了今后的发展方向。
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| 关 键 词： | 电子组装 免清洗助焊剂 无铅化 无VOC 活化剂 |
Research Progress of No-Clean Flux in Electronic Packaging |
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| LIU Yue,DING Yunhu,MAO Zuguo,HUANG Xinglin,WANG Zhuyuan,HUANG Chaozhi. Research Progress of No-Clean Flux in Electronic Packaging[J]. Plating & Finishing, 2017, 39(6). DOI: 10.3969/j.issn.1001-3849.2017.06.004 |
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| Authors: | LIU Yue DING Yunhu MAO Zuguo HUANG Xinglin WANG Zhuyuan HUANG Chaozhi |
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| Abstract: | This paper describes the role and the classification of flux briefly;mainly introduces the characteristics,types and test methods of no-clean flux,presents several new types of no-clean flux and the general research progress;illustrates the effect of compositions of no-clean flux,such as activators,solvents,surfactants and other additives.In the end,this paper points out some existing problems and looks ahead the prospect of the development in future. |
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| Keywords: | electronic assembly no-clean flux lead-free VOC-free activator |
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