钝化工艺对HEDP镀铜层耐蚀性的影响

采用盐水浸泡试验、硝酸点滴试验以及电化学测试方法,研究了苯并三氮唑、苯并三氮唑与Cr(Ⅲ)复配、苯并三氮唑与铈盐复配、Cr(Ⅵ)以及HAD无铬钝化工艺对HEDP镀铜层耐蚀性的影响。结果表明,经苯并三氮唑复配钝化液钝化处理后,钝化膜耐蚀性较单一的苯并三氮唑钝化稍有提高,但均不及Cr(Ⅵ)钝化处理,而经HAD无铬钝化处理后,钝化膜耐硝酸点滴时间最长,在3.5%Na Cl溶液中的Rct最大,icorr最小,耐蚀性明显优于Cr(Ⅵ)钝化处理。

Effects of Passivation Process on Corrosion Resistance of HEDP Copper Plating Layer

The effects of BTA,BTA/trivalent chromium complexes,BTA/cerium salt complexes,hexavalent chromium and HAD chromium-free passivation process on corrosion resistance of HEDP copper plating layer were studied by salt leaching test,nitric acid titrating test and electrochemical test method.The results showed that corrosion resistance of the passivation film obtained in BTA compound passivation solution was slightly improved as compared with that obtained in single BTA passivation solution,but all of them were not as good as that obtained in hexavalent chromium passivation solution.For the passivation film treated with HAD chromium-free passivation solution,its nitric acid titrating time was the longest,Rct in 3.5％ NaCl was the largest while icorr was the smallest.Compared with hexavalent chromium passivation solution,corrosion resistance of the paasivation film obtained in HAD chromium-free passivation solution was significantly improvod.