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硅表面化学镀镍研究
引用本文:蒋金金,吴王平,袁同心,王亮兵,李晓艳,江鹏,王知鸷,孔德军. 硅表面化学镀镍研究[J]. 电镀与精饰, 2017, 39(10). DOI: 10.3969/j.issn.1001-3849.2017.10.004
作者姓名:蒋金金  吴王平  袁同心  王亮兵  李晓艳  江鹏  王知鸷  孔德军
作者单位:1. 机械工程学院常州大学,江苏常州,213164;2. 机械工程学院常州大学,江苏常州213164;江苏省绿色过程装备重点实验室常州大学,江苏常州213164;3. 中航工业天津航空机电有限公司,天津,300308
基金项目:江苏省高校自然科研面上项目和江苏省青年自然科学基金项目
摘    要:化学镀镍具有优异的特性,广泛应用于塑料、半导体和金属的表面保护涂层,其中半导体硅表面化学镀镍已有深入的研究。针对硅基体表面化学镀镍的研究进展和成果进行了详细介绍,主要包括硅基体表面的预处理方法、化学镀镍工艺,硅基体表面化学镀镍的反应机理和添加剂对化学镀镍的影响研究,并总结展望了硅基体表面化学镀镍的发展趋势。

关 键 词:  化学镀  

Study of Eletroless Nickel on Silicon Surface
Jinjin Jiang,Wangping Wu,Tongxin Yuan,Liangbing Wang,Xiaoyan Li,Peng Jiang,Zhizhi Wang,Dejun Kong. Study of Eletroless Nickel on Silicon Surface[J]. Plating & Finishing, 2017, 39(10). DOI: 10.3969/j.issn.1001-3849.2017.10.004
Authors:Jinjin Jiang  Wangping Wu  Tongxin Yuan  Liangbing Wang  Xiaoyan Li  Peng Jiang  Zhizhi Wang  Dejun Kong
Abstract:Electroless nickel(Ni) possesses excellent characteristics,which could be widely used as surface protective coating of plastics,semiconductor and metal,and among which,Electroless Ni on the silicon surface semiconductor has been made a thorough research.In this work,the primary results and progress of electroless Ni on the silicon substrate surface is introduced in detail,mainly including the pretreatment methods and electroless Ni process technology on silicon substrate surface,the chemical reaction mechanism of electroless Ni on the silicon substrate surface.And the influence of additives on the electroless Ni was also studied.And the future development trend of electroless Ni on the silicon substrate surface was summarized and predicted.
Keywords:Silicon  Electroless  Nickel
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