A new Thermo-viscoplastic Material Model for Finite-Element-Analysis of the Chip Formation Process |
| |
Authors: | G. Warnecke J.-D. Oh |
| |
Affiliation: | Institute for Manufacturing Engineering and Production Management, University of Kaiserslautern, P.O. Box 3049, 67653 Kaiserslautern, Germany Tel: +49.631.205.2617, Fax: +49.631.205.3238 |
| |
Abstract: | A new material model for describing the thermo-viscoplastic flow behavior of workpiece material in metal cutting is presented. In order to express the complex flow behavior which depends on the local strain, strain rate and temperature, a new methodology for sequential formulation is proposed. The material parameters which are achieved by using the flow stress data available at low strain rates are enhanced by matching the results of the experimental investigations and finite element simulations of the orthogonal cutting process. As a result, a material model which has a wide validity range of strain, strain rate and temperature is established. |
| |
Keywords: | Chip formation Material model Finite element method |
本文献已被 ScienceDirect 等数据库收录! |
|