首页 | 本学科首页   官方微博 | 高级检索  
     

高频介质加热在木材胶合中的应用
引用本文:陈勇平,王金林,李春生,王志同. 高频介质加热在木材胶合中的应用[J]. 木材加工机械, 2007, 18(5): 37-41
作者姓名:陈勇平  王金林  李春生  王志同
作者单位:中国林业科学研究院木材工业研究所,北京,100091
基金项目:国家支撑专题,引进国际先进林业科学技术创新项目专题
摘    要:从高频胶合的原理出发,介绍了高频胶合的特点及高频加热系统,分析了国内外高频胶合的研究现状,探讨高频胶合中存在的问题,最后提出了高频胶合今后的发展方向.

关 键 词:高频  加热  木材  胶合
文章编号:1001-036X(2007)05-0037-05
修稿时间:2007-07-10

The application of high-frequency heating technology in wood bonding process
CHEN Yong-ping,WANG Jin-lin,LI Chun-sheng,WANG Zhi-tong. The application of high-frequency heating technology in wood bonding process[J]. Wood Processing Machinery, 2007, 18(5): 37-41
Authors:CHEN Yong-ping  WANG Jin-lin  LI Chun-sheng  WANG Zhi-tong
Abstract:In this paper the basic principles and traits of high-frequency bonding and the relevant heating system were briefly described.Meanwhile,the application of high-frequency technology in wood bonding was reviewed,and the existing problems were also pointed out:finally,the development trend of high-frequency bonding was put forward.
Keywords:high-frequency  heating  wood  bonding
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号