| 化学镀锡工艺参数对沉积速率、镀层厚度及表面形貌的影响 |
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| 引用本文： | 徐磊,何捍卫,周科朝,刘洪江. 化学镀锡工艺参数对沉积速率、镀层厚度及表面形貌的影响[J]. 材料保护, 2009, 42(5) |
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| 作者姓名： | 徐磊 何捍卫 周科朝 刘洪江 |
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| 作者单位： | 中南大学粉末冶金国家重点实验室,湖南,长沙,410083 |
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| 摘 要： | 目前,铜基或铁基上化学镀锡存在连续性差、沉积速率慢等问题,为实现连续化学镀锡,提高沉积速率,设计了一种新的化学镀锡工艺,考察了化学镀锡主要工艺参数(镀液主成分、pH值、温度、施镀时间)对镀层表面形貌及厚度的影响.结果表明,最佳工艺参数为:20.0～25.0 g/L氯化亚锡,70.0～75.0 g/L次亚磷酸钠,70.0～75.0 g/L硫脲,75.0～80.0 g/L硫酸,5.0～8.0 g/L甲基磺酸,50.0～8.0 g/L EDTA,2.0～4.0 g/L对苯二酚,10.0～15.0 g/L乙二醇,0.5～1.0 g/L磷酸,0.5～1.0 g/L甲醛,0.5～1.0 g/L OP-10,温度80～85℃,pH值0.6～0.8.该工艺可实现连续化学镀锡,施镀3h厚度可达32.72μm.
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| 关 键 词： | 化学镀锡 工艺参数 连续化学镀 厚度 表面形貌 |
Effect of Plating Parameters on Plating Rate and Thickness as well as Surface Morphology of Electroless Tin Coating |
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| XU Lei,HE Han-wei,ZHOU Ke-chao,LIU Hong-jiang. Effect of Plating Parameters on Plating Rate and Thickness as well as Surface Morphology of Electroless Tin Coating[J]. Journal of Materials Protection, 2009, 42(5) |
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| Authors: | XU Lei HE Han-wei ZHOU Ke-chao LIU Hong-jiang |
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| Affiliation: | XU Lei,HE Han-wei,ZHOU Ke-chao,LIU Hong-jiang (State Key Laboratory of Powder Metallurgy,Central South University,Changsha 410083,China) |
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| Abstract: | In order to realize continuous tin electroless plating and increase the deposition rate, a new method was established. The effects of plating parameters (such as bath composition, pH val-ue, temperature, plating time, and stirring rate) on the surface morphology and thickness of the coating were investigated by means of scanning electron microscopy (SEM) , X-ray diffraction (XRD) , energy dispersive spectrometry (EDX) , and chemical analysis. Results show that the optimal temperature and pH value for tin el... |
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| Keywords: | electroless tin plating plating parameters continuous electroless plating thickness surface morphology |
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