环氧模塑料在半导体封装中的应用

环氧模塑料是一种重要的微电子封装材料，是决定最终封装性能的主要材料之一，具有低成本和高生产效率等优点，目前已经成为半导体封装不可或缺的重要材料。本文简单介绍了环氧模塑料在半导体封装中的重要作用和地位；分析了环氧模塑料性能对半导体封装的影响，并对不同半导体封装对环氧模塑料的不同要求进行了分析；最后展望半导体封装和环氧模塑料的未来发展趋势，以及汉高华威公司在新产品开发中的方向。

Application of Epoxy Molding Compound on Semiconductor Package

Epoxy molding compound(EMC)is one of the most important micro-electronic packaging material. It is one of the key material which determines the final performance of semiconductor packages. Due to its low cost and high performance, epoxy molding compound now becomes the major solution for semiconductor package. In this paper, the importance and situation of EMC in semiconductor package is expatiated, the different requirement of different semiconductor packaging on epoxy molding compound was analyzed as well. The trend of semiconductor package and EMC was discussed on the final part. The direction of Henkel Huawei new product development team was introduced also.