浮动蒸汽腔散热器性能测试与仿真回归分析

随着各类电子器件与设备的小型化和多样化，产品功耗与热流密度也在发展迭代中迅速攀升，对高效散热的需求越来越强烈。文中主要针对均热问题，介绍了蒸汽腔均热技术的基本原理，通过实测对比了一种浮动蒸汽腔散热器与传统热管散热器的均热性能，也对抗重力性能进行了测试分析和仿真回归。结果表明，浮动蒸汽腔散热器的均热性能优于传统热管散热器，而重力的方向对其均热能力有影响，应用中不推荐两片蒸汽腔处于上下相对位置的竖直状态。仿真回归得到的蒸汽腔等效导热系数可供后续产品设计参考。

Experimental Analysis and Simulation on Heat Dissipation Performance of Floating Heat Sink with Vapor Chamber

With the miniaturization and diversification of electronic components and devices, the power density and heat flux increase rapidly during the development and iteration. That brings rising demands on highly effective heat dissipation. Focused on the problem of heat spreading, the paper gives an introduction to the basic principle of vapor chamber (VC) heat spreading technology. A specific floating heat sink with VC is tested and analyzed to compare its heat spreading performance with conventional heat sink using heat pipe. The antigravity performance is also studied and regressed in simulation. The results show that the floating heat sink with VC performs better than conventional heat sink using heat pipe in heat spreading, while its performance can be influenced by different directions of gravity. It is not recommended to use two VCs in a vertical state with one piece above another. The equivalent heat conductivity coefficient obtained from simulation can be used as a reference in future designs of related products.