首页 | 本学科首页   官方微博 | 高级检索  
     

某电子设备整机结构热设计
引用本文:刘斌,牟长军,王立,郑延帅. 某电子设备整机结构热设计[J]. 电子机械工程, 2020, 36(1): 34-37, 41
作者姓名:刘斌  牟长军  王立  郑延帅
作者单位:中国电波传播研究所,中国电波传播研究所,中国电波传播研究所,中国电波传播研究所
摘    要:文中以某电子设备研发为例,根据产品实际工况,利用工程经验公式对该设备的热设计进行了分析计算,确定了设备的冷却方式、风机规格及散热器参数等。在此基础上,采用Icepak热分析软件对设备的温度场分布情况进行了仿真。随后,根据环境适应性指标开展了温度试验,并与仿真结果进行了对比。仿真和试验的结果表明:该设备的热设计满足系统的环境适应性指标要求,理论计算和热仿真分析方法实用、有效,对同类设备的设计具有重要的参考价值。

关 键 词:电子设备  热设计  结构设计  Icepak

Thermal Design of a Certain Electronic Equipment
LIU Bin,MOU Changjun,WANG Li and ZHENG Yanshuai. Thermal Design of a Certain Electronic Equipment[J]. Electro-Mechanical Engineering, 2020, 36(1): 34-37, 41
Authors:LIU Bin  MOU Changjun  WANG Li  ZHENG Yanshuai
Affiliation:China Research Institute of Radiowave Propagation,China Research Institute of Radiowave Propagation,China Research Institute of Radiowave Propagation and China Research Institute of Radiowave Propagation
Abstract:Taking the research and development of a certain electronic equipment as an example, the thermal design of equipment is analyzed and calculated according to the actual work conditions and the engineering empirical formula. The cooling mode, fan specifications and radiator parameters of the equipment are determined. On this basis, the temperature field distribution of the equipment is simulated by thermal analysis software Icepak. Then the temperature test is carried out according to the environmental adaptability indexes. And the test results are compared with the simulation results. The simulation and experiment results show that the thermal design can satisfy the system environment adaptability indexes, and the theoretical calculation and thermal simulation analysis method are practical and effective,which has important reference value to the similar product design.
Keywords:electronic equipment   thermal design   structure design   Icepak
点击此处可从《电子机械工程》浏览原始摘要信息
点击此处可从《电子机械工程》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号