Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films |
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| Authors: | T L Su L C Tsao S Y Chang T H Chuang |
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| Affiliation: | (1) Department of Materials Science and Engineering, National Taiwan University, 106 Taipei, Taiwan, China |
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| Abstract: | The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range
from 250–325 °C, and the morphology of intermetallic compounds formed after such soldering reactions is observed. In kinetics
analysis of the growths of intermetallic compounds, it was found that both Sn/Ag and Sn-3.5Ag/Ag reactions were interfacial-controlled,
and the growth rates for both cases were similar. The rate of Ag dissolution into liquid solder attendant on the formation
of interfacial intermetallic compounds after Sn/Ag reaction was about four times higher than that after Sn-3.5Ag/Ag reaction,
as evidenced by experimental results. |
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| Keywords: | Ag dissolution Ag3Sn intermetallic compound Ag thick film Sn/Ag Sn-3 5Ag/Ag soldering reactions |
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