High Strength and Thermal Stability of Multilayered Cu/Al Composites Fabricated Through Accumulative Roll Bonding and Cryorolling

Multilayered Cu/Al composites with high strength and thermal stability were successfully fabricated by combining accumulative roll bonding (ARB) and cryorolling. The microstructure, tensile properties, and thermal stability of the multilayered Cu/Al composites subjected to cold rolling and cryorolling were analysed. Subsequent cryorolling can be used to modify interfacial flatness and local necking, induce the formation of high-density stacking faults in the Cu matrix, and enhance interfacial bonding strength, which improves the mechanical properties of ARB composites. The initial lamellar structure is gradually transformed into serious mixing with an increase in annealing temperature, accompanied by the formation of excessive Cu–Al intermetallic compounds (IMCs). Cryorolled samples exhibited higher thermal stability than cold-rolled samples. At low annealing temperature, high-density stacking faults induced by cryorolling facilitated the transition from low-angle grain boundaries to high-angle grain boundaries, which led to the formation of ultra-fine grains. For the samples annealed at high temperatures, cryorolling led to the effective inhibition of Cu–Al IMC formation and growth due to the genetic effect of less heat input.

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