| 基于焊点形态理论的SMT焊点质量模糊故障诊断技术研究 |
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| 引用本文： | 李春泉,周德俭,吴兆华. 基于焊点形态理论的SMT焊点质量模糊故障诊断技术研究[J]. 中国机械工程, 2004, 15(21): 1967-1970 |
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| 作者姓名： | 李春泉 周德俭 吴兆华 |
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| 作者单位： | 1. 桂林电子工业学院机电与交通工程系,桂林,541004;上海大学CIMS中心,上海,200072
2. 桂林电子工业学院机电与交通工程系,桂林,541004 |
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| 基金项目： | 广西壮族自治区自然科学基金资助项目 (桂教科研[2 0 0 2 ] 3 16号 ) |
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| 摘 要： | 根据SMT焊点质量与焊点的三维几何形态直接相关的特点，提出了SMT焊点形态理论。以该理论为支持，提出了SMT焊点质量模糊诊断技术。将实际焊点几何形态与合理焊点几何形态对应比较，作为模糊输入向量，以焊点的故障缺陷发生可能度作为模糊输出向量。通过可信度约束的模糊规则与正反向模糊推理，进行焊点质量模糊故障诊断。以四边扁平封装器件(QFP)为例，进行了实例验证。
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| 关 键 词： | 表面组装技术 焊点形态理论 焊点质量 故障诊断 |
| 文章编号： | 1004-132X(2004)21-1967-04 |
Study on SMT Solder Joint Quality Fuzzy Diagnosis Technology Based on the Theory of Solder Joint Shape |
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| Li Chunquan , Zhou Dejian Wu Zhaohua . Guilin University of Electronic Technology,Guilin. Study on SMT Solder Joint Quality Fuzzy Diagnosis Technology Based on the Theory of Solder Joint Shape[J]. China Mechanical Engineering, 2004, 15(21): 1967-1970 |
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| Authors: | Li Chunquan Zhou Dejian Wu Zhaohua . Guilin University of Electronic Technology Guilin |
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| Affiliation: | Li Chunquan 1,2 Zhou Dejian 1 Wu Zhaohua 11. Guilin University of Electronic Technology,Guilin,5410042. Shanghai University,Shanghai,200072 |
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| Abstract: | According to the characteristics that SMT solder joint quality is related to its 3-D geometrical shape directly, theory of solder joint shape was put forward. On the basis of this theory, SMT solder joint quality fuzzy diagnosis technology was studied. Firstly, the actual solder joint geometrical shapes were compared with the reasonable data, then the results were taken as the fuzzy input vectors and possibility of solder joint disfigurement was taken as the fuzzy output vector. The solder joint quality can be diagnosed through fuzzy principle and fuzzy inference forward and back. Finally, an example of quad flat pack(QFP) is analyzed to testify its correctness. |
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| Keywords: | SMT theory of solder joint shape solder joint quality fault diagnosis |
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