Study of dynamic grain growth by electron microscopy and EBSD

The effect of hot deformation on fully recrystallized aluminium–copper alloys (Al-4wt%Cu and Al-33wt%Cu) with different volume fractions of CuAl₂ has been studied. The alloys are Zener pinned systems with different superplastic properties. Strain-induced grain growth, observed in both alloys, was quantitatively estimated by means of electron microscopy and EBSD and compared with the rate of static grain growth. Surface marker observations and in situ hot-deformation experiments combined with EBSD were aimed at clarifying the mechanisms responsible for the changes in the deformed microstructures. A sequence of secondary and backscattered electron images and EBSD maps was obtained during in situ SEM deformation with different testing conditions. Overlaying EBSD maps for the Al-4wt%Cu with channelling contrast images showed that grain boundary motion occurred during deformation, creating a layered structure and leading to an increase in size of some grains and shrinkage of others. Of a particular interest are results related to behaviour of CuAl₂ in superplastic Al-33wt%Cu during deformation, including several problems with the use of EBSD in this alloy.