Depth Dependence of Nanoindentation Pile-Up Patterns in Copper Single Crystals

A study of the dependence of nanoindentation pile-up patterns on the indentation load and crystallographic orientation is presented. Three different orientations—(001), (011), and (111)—of single crystal copper were investigated. Experiments were conducted on a CSM ultra-nanoindentation tester using a Berkovich tip. The topographic images were obtained using an atomic force microscope. The evolution of pile-up patterns with different applied loads was observed. The results show that for applied loads equal to 0.45 mN and smaller the pile-up patterns do not depend on the crystallographic orientation of the indented surface; instead, they depend on the tip’s geometry. On the other hand, in the case of indentation loads bigger than 2 mN, pile-up patterns on the surfaces of (001)-, (011)-, and (111)-oriented single crystals have fourfold, twofold, and sixfold (or threefold) symmetry, respectively. An intermediate state was also reported. Furthermore, a detailed analysis of residual impressions with maximal applied loads equal to 2 mN and bigger reveals that both pile-up and sink-in patterns are present.