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Improvement of sensitivity of eddy current sensors for nano-scale thickness measurement of Cu films |
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| Affiliation: | 1. The key laboratory for advanced food manufacturing equipment technology of Jiangsu province, Wuxi, 214122, China;2. School of Mechanical Engineering, Jiangnan University, Wuxi, 214122, China;3. College of Electrical and Information Engineering, Hunan University, Changsha, 410082, China;4. National Center of Quality Supervision and Inspection for Commodity, Yiwu, 322000, China;1. School of Electronic and Information Engineering, Fuqing Branch of Fujian Normal University, Fuqing 350300, PR China;2. Department of Civil and Architectural Engineering, Changsha University, Changsha 410022, PR China;3. College of Electrical and Information Engineering, Hunan University, Changsha 410082, PR China;4. School of Electrical and Electronic Engineering, Newcastle University, Newcastle upon Tyne NE1 7RU, United Kingdom |
| Abstract: | Measurement of nano-scale copper film thickness is of great importance in the semiconductor industry. The eddy current method is used for the purpose due to its non-destructive and fast dynamic response features. In this paper, an equivalent circuit model is used to get the relationship between the measurement sensitivity and sensor parameters. It is found that the internal resistance of an eddy current sensor plays a primary role in the improvement of the measurement sensitivity beside of the Q factor of the sensor. A simple experimental setup is established and a series of Cu films with the thicknesses ranging from 20 nm to 350 nm are prepared as test samples. Test results indicate that the sensitivity of an optimized sensor made of a lower resistant multi-wire Cu line has better sensitivity than that wound with a higher resistant single Cu wire under large lift-off. |
| Keywords: | Eddy current sensor Metal film thickness measurement Sensitivity |
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