具有金刚石/铜中间层W-RAFM模块的制备与评价

为了缓解钨-低活化钢(W-RAFM)直接连接产生的热应力,加入热膨胀系数介于二者之间的高导热金刚石/铜复合材料作为中间层,并在金刚石/铜两侧辅以Cu Cr Zr箔,达到较高的连接强度。利用超高压力通电短时高效的特点,一次性制备出有金刚石/铜层的W-RAFM模块。ANSYS Workbench的热冲击数值模拟显示,模块可承受1~2 MW/m2的稳态热流冲击。

Preparation and Performance Evaluation of W-RAFM Mock-up with Diamond/Cu Interlayer

A W-RAFM mock-up with diamond/Cu intermediate layer was designed and proposed. With the suitable thermal expansion coefficient and the high thermal conductivity of diamond/Cu, the stress of W-RAFM with diamond/Cu interlayer is released and the mock-up has a good thermal effect. CuCrZr foil is set as stress buffer layers on both sides of the diamond/Cu intermediate layer to enhance connection strength. The mock-up is produced with one time effort with the high temperature, high pressure, short time and high efficiency of the cubic press. Numerical simulation of thermal shock on the mock-up was carried out in the ANSYS Workbench, and it shows that the mock-up can suffer from a steady state heat flux of 1~2 MW/m2.