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铝箔基包装材料高频感应封合电磁场3D有限元模拟
引用本文:张建国,阳恩会,王石刚,于红专. 铝箔基包装材料高频感应封合电磁场3D有限元模拟[J]. 食品与机械, 2012, 28(3): 154-158
作者姓名:张建国  阳恩会  王石刚  于红专
作者单位:1. 上海应用技术学院机械工程学院,上海,201418
2. 上海超群无损检测设备有限责任公司,上海,201615
3. 上海交通大学机械与动力工程学院,上海,200240
4. 上海奇尚通信科技有限公司,上海,200233
基金项目:上海高校选拔培养优秀青年教师科研专项基金,上海应用技术学院引进人才科研启动项目
摘    要:针对无菌饮料灌装中铝箔基复合包装材料有选择性局部封合的需要,建立其高频感应封合系统电磁场的3D有限元数值模型,并对不同参数条件下铝箔上的涡流分布和大小进行分析,为铝箔基高频感应封合系统中封合装置的设计提供基础。

关 键 词:无菌饮料灌装  铝箔基包装材料  高频感应封合  电磁场  有限元

3D electromagnetic filed simulation for high frequency induction sealing of aluminum foil based packaging material using finite element method
ZHANG Jian-guo , YANG En-hui , WANG Shi-gang , YU Hong-zhuan. 3D electromagnetic filed simulation for high frequency induction sealing of aluminum foil based packaging material using finite element method[J]. Food and Machinery, 2012, 28(3): 154-158
Authors:ZHANG Jian-guo    YANG En-hui    WANG Shi-gang    YU Hong-zhuan
Affiliation:1.School of Mechanical Engineering,Shanghai Institute of Technology,Shanghai 201418,China;2.Shanghai Advanced NDT Equipment Co.,Ltd,Shanghai 201615,China;3.School of Mechanical Engineering,Shanghai Jiao Tong University,Shanghai 200240,China;4.Shanghai Qishang Telecom Technology Co.,Ltd,Shanghai 200233,China)
Abstract:For the need of local and selective induction sealing of aluminum foil based composite packaging material,the 3D finite element numerical model for sealing electromagnetic field of high frequency induction sealing system was founded.The influences of different factors to eddy current distribution on aluminum foil were studied and analyzed.These analyses and simulations are the foundations of the design of induction sealing apparatus of sealing system.
Keywords:aseptic filling  aluminum foil based packaging material  high frequency induction sealing  electromagnetic field  finite element
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