微电子封装用导电胶的研究进展

随着现代科学技术的高速发展,电子产品向小型化、便携化和集成化方向发展。导电胶作为一种"无铅、绿色和环境友好"的新型材料取代传统的Pb/Sn材料,已成为电子工业组装材料的主流。简述了微电子封装用导电胶的组成和分类、研究进展和可靠性评估,提出了导电胶在微电子封装中的技术问题,并对其发展趋势和发展前景作了展望。

Research progress of conductive adhesive in micro-electronic encapsulation

With the rapid development of modern science and technology,the development direction of electronic products are miniaturization,portability and integration.The conductive adhesives as replacer of traditional Pb/Sn materials are a mainstream of assembly materials in electron industry because the conductive adhesives were a plumbum-free,green and environment friendly new type materials.The composition and classification,research progress and reliability are briefly reviewed for conductive adhesive.The techno...