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Getting the lead out of surface finishing: Consider gold-based finishes, which produce a reliable solder joint, as an alternate source for printed circuitry |
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| Authors: | George Milad |
| Affiliation: | Uyemura International Corp., Southington, Conn., USA |
| Abstract: | |
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| 本文献已被 ScienceDirect 等数据库收录！ | |