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SMT回流焊温度测试仪的设计
引用本文:朱启文,周井泉.SMT回流焊温度测试仪的设计[J].现代电子技术,2007,30(1):165-166,175.
作者姓名:朱启文  周井泉
作者单位:南京邮电大学,光电工程学院,江苏,南京,210003
摘    要:在表面组装技术中,炉温测试对于检测和监控回流焊质量是极其重要的,回流焊温度测试仪就是检测温度变化曲线的设备。本文设计的回流焊温度测试仪由现场单片机控制的测试系统和上位微机组成。现场单片机控制的测试系统对温度进行采集和处理,并通过串口发送给微机,由微机实现数据分析、曲线显示和打印。实验结果表明,该测试仪能够准确地测出回流焊温度。

关 键 词:表面组装技术(SMT)  温度测试仪  回流焊  单片机
文章编号:1004-373X(2007)01-165-02
收稿时间:2006-06-12
修稿时间:2006-06-12

Design of Temperature Instrument of Reflow Soldering in SMT
ZHU Qiwen,ZHOU Jingquan.Design of Temperature Instrument of Reflow Soldering in SMT[J].Modern Electronic Technique,2007,30(1):165-166,175.
Authors:ZHU Qiwen  ZHOU Jingquan
Affiliation:ZHU Qiwen,ZHOU Jingquan (College of Opto - electronic Engineering, Nanjing University of Posts & Telecommunications, Nanjing, 210003, China)
Abstract:In Surface Mounted Technique(SMT),temperature detection of reflow soldering oven is important to inspect and control the quality of soldering.Reflow soldering temperature instrument is a mean to detect the temperature.In this paper,we design an instrument that consists of a detection system controlled by single chip microprocessor and a computer.The temperature is sampled and converted into data in detection system,and these data are transferred to computer through series port.Temperature curves are analyzed,displayed or printed by computer.Practical results show this instrument can detect the temperature of reflow soldering oven exactly.
Keywords:Surface Mounted Technique(SMT)  temperature detection instrument  reflow soldering  single chip
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