一种新型集成化X波段低噪声放大器

低温共烧陶瓷 (LTCC)和倒装芯片 (FC)是实现小型化、高可靠微波组件的一种理想的组装和互连技术。文中对带有埋置式电阻的 LTCC微波多层互连基板和倒装芯片组装技术进行了研究 ,以研制出体积小、重量轻、微波性能好的高密度集成化 X波段低噪声放大器。利用商用三维电磁场分析软件 HFSS对集成化低噪声放大器组装和互连中的关键参数进行了仿真和优化。研制出的集成化 X波段低噪声放大器带宽为 1 .6GHz,增益≥ 2 8d B,噪声系数≤ 2 d B,输入 /输出驻波≤ 1 .8,体积仅为 1 2 mm× 6mm× 1 .5 mm。

Development of a Novel Integrated X-band Low Noise Amplifier

Low temperature co fired ceramic s (LTCC) and flip chip (FC) are excellent packaging and interconnection technologi es for realizing miniature and high reliable microwave modules. The LTCC microwa ve multilayer interconnection substrates with embedded resistors and MMIC flip c hip attachment technologies were studied in this paper to develop high density a nd integrated X band low noise amplifier (LNA) with samll volume, light weight a nd good microwave performances. Some critical parameters of packaging and interc onnection of the integrated LNA were simulated and optimized by using commercial 3D electromagnetic field analysis software HFSS. The bandwidth, gain, noise fig ure and input/output VSWR of the integrated X band LNA are 1 6 GHz, more than 2 8 dB, less than 2 dB and less than 1 8 respectively. The volume of the LNA is o nly 12×6×1 5 mm 3.