| 冷却速率对无铅钎料和焊点质量影响 |
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| 引用本文： | 张彬彬,王春青.冷却速率对无铅钎料和焊点质量影响[J].电子工艺技术,2007,28(2):71-73,77. |
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| 作者姓名： | 张彬彬 王春青 |
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| 作者单位： | 哈尔滨工业大学现代焊接生产技术国家重点实验室,黑龙江,哈尔滨,150001;哈尔滨工业大学现代焊接生产技术国家重点实验室,黑龙江,哈尔滨,150001 |
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| 摘 要： | 阐述了再流焊冷却速率对无铅钎料和焊点质量的影响的研究现状.已有的研究结果表明:冷却速率对于无铅钎料的微观组织、拉伸性能、金属间化合物的形态和尺寸以及焊点中的凝固缺陷等都有显著的影响.选择合适的冷却速率可以提高焊点质量.
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| 关 键 词： | 冷却速率 无铅钎料 焊点质量 |
| 文章编号： | 1001-3474（2007）02-0071-04 |
| 修稿时间： | 2007-01-08 |
Research of Effect of Cooling Rate on Lead- free Solder and Solder Joint Quality |
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| ZHANG Bin-bin,WANG Chun-qing.Research of Effect of Cooling Rate on Lead- free Solder and Solder Joint Quality[J].Electronics Process Technology,2007,28(2):71-73,77. |
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| Authors: | ZHANG Bin-bin WANG Chun-qing |
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| Affiliation: | Harbin Institute of Technology, Harbin 150001, China |
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| Abstract: | Introduce the research of effect of cooling rate on the lead - free solder and solder joint quality. The current research indicates that cooling rate has prominent effects on microstructure and tensile properties of lead - free solders, the morphology and thickness of intermetallic compounds, and solidification defects in lead - free solder joints. It is important to tailor cooling rate to improve solder joint quality. |
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| Keywords: | Cooling rate Lead - free solder Solder joint quality |
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