| 三价铬电沉积研究状况 |
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| 引用本文： | 雷华山,何湘柱,舒绪刚.三价铬电沉积研究状况[J].材料导报,2008(5):25-27. |
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| 作者姓名： | 雷华山 何湘柱 舒绪刚 |
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| 作者单位： | 广东工业大学轻化工学院,广州510006 |
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| 基金项目： | 国家自然科学基金资助项目（50004003）;湖南省自然科学基金资助项目（OOJJY20118）;湖南省教委高校科研项目（99C162） |
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| 摘 要： | 阐述了目前三价铬电沉积研究的主要内容，包括镀层增厚问题、镀液稳定性的探讨和机理研究，指出了当前三价铬电沉积存在的主要问题，并简单介绍了有关三价铬最近几年的发展趋势，指出三价铬非晶态合金及复合镀层的研究是今后一段时间电镀行业研究的主要走向。
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| 关 键 词： | 三价铬还原机理 非晶态合金 复合镀 |
Research Status of Trivalent Chromium Electrodeposition |
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| LEI Huashan,HE Xiangzhu,SHU Xugang.Research Status of Trivalent Chromium Electrodeposition[J].Materials Review,2008(5):25-27. |
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| Authors: | LEI Huashan HE Xiangzhu SHU Xugang |
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| Affiliation: | (Faculty of Light and Chemical Engineering, Guangdong University of Technology, Guangzhou 510006) |
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| Abstract: | The main coverage of the present trivalent chromium electrodeposition is elucidated, including the coating accumulation question, the discussion about the stability of plating solution and file mechanism research. And the current main problems in the trivalent chromium electrodeposition are pointed out. Simultaneously the development trend of trivalent chromium in recent years is introduced simply, and it＇s pointed out that the research on trivalent chromium amorphous alloys and composite plate will be a main direction for the galvanization industry research in future. |
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| Keywords: | trivalent chromium reduction mechanism amorphous alloy composite plating |
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