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Intra- and inter-temperature measurement BIST for SiP module using digital frequency analyser circuit
Authors:Han  CH Lee  J-W Hong  SH
Affiliation:College of Electronics and Information, Kyung Hee University, 1, Seocheon-dong, Giheung-gu, Yongin-si, Gyeonggi-do 446-701, Republic of Korea;
Abstract:A method and a novel circuitry for intra- and inter-chip temperature measurement in a system in a package (SiP) module is presented. The proposed built-in self-test (BiST) system for the SiP module features a newly proposed digital frequency analyser (DFA) that can be used to efficiently discern clock period differences of up to 1 ns. The full digital interface of the DFA enables power and area efficient temperature measurements in an SiP.
Keywords:
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