| 低成本银基厚膜多层基板的研制 |
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| 引用本文： | 谢廉忠 周勤. 低成本银基厚膜多层基板的研制[J]. 电子工艺技术, 1997, 18(2): 72-74 |
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| 作者姓名： | 谢廉忠 周勤 |
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| 作者单位： | 电子部第十四研究所 |
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| 摘 要： | 介绍低成本银基厚膜多层基板的材料系统，工艺流程，工艺特性以及基板的性能。
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| 关 键 词： | 银基 厚膜电阻 厚膜电路 |
The Development of Low-cost Silver Bearing Thick Film Multilayer Substrate |
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| Xie Lianzhong Zhou Qin Jiang Hong. The Development of Low-cost Silver Bearing Thick Film Multilayer Substrate[J]. Electronics Process Technology, 1997, 18(2): 72-74 |
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| Authors: | Xie Lianzhong Zhou Qin Jiang Hong |
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| Affiliation: | Xie Lianzhong Zhou Qin Jiang Hong |
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| Abstract: | The paper introduces the materials system,processing,process properties and characteristic for low-cost Silver-bearing thick film multilayer Substrate |
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| Keywords: | Low-cost Silver-bearing Thick film Resisters |
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