Microstructure-Property Relations of Hot-Pressed Silicon Carbide-Aluminum Nitride Compositions at Room and Elevated Temperatures

A series of SiC-AlN compositions of 0, 10, 25, 50, 75, 90, and 100 mol% AlN were hot pressed at 2100°C for a 1 h soak at a pressure of 35 MPa under vacuum. 2H-wurtzite SiC-AlN solid-solution structures were formed for compositions with 25-100 mol% AlN. The associated lattice parameters for these solid solutions followed Vegard's law. The microstructures varied with composition; the number of needlelike grains decreased for compositions up to 25 mol% AlN and the amount of equiaxed grains increased for compositions with 25–100 mol% AlN. Densities for all the specimens were >99% of the theoretical density. Coefficients of thermal expansion varied from 4.80 × 10^-6/°C to 6.25 × 10^-6/°C in the 20°-1400°C range. Young's moduli varied from 451 GPa to 320 GPa at room temperature (RT) and retained 98%, 96%, and 94% of their RT values at 500°, 1000°, and 1250°C, respectively. These three properties correlated linearly with composition. RT microhardness varied from 21.6 GPa to 11.2 GPa and correlated linearly with composition within the solid-solution range. Flexural strengths increased from 487 MPa to 604 MPa from 0 mol% AlN to 25 mol% AlN and then decreased to 284 MPa for 100 mol% AlN. At 1250°C, flexural strengths decreased from 90% to 65% of the RT values. Fracture toughness increased from 3.6 MPa·m^1/2 to 4.2 MPa·m^1/2 from 0 mol% AlN to 10 mol% AlN and then decreased to 2.5 MPa·m^1/2 for 100 mol% AlN.