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Behaviour of CPW and TFMS lines at high temperature for RF applications in sub-45 nm nodes |
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| Authors: | C Roda Neve A Farcy B Blampey L Arnaud |
| Affiliation: | a Microwave Lab., Université catholique de Louvain, Place du Levant, 3, B-1348 Louvain-la-Neuve, Belgium b STMicroelectronics, 850 rue Jean Monnet, 38920 Crolles, France c IMEP-LAHC, Université de Savoie, 73376 Le Bourget du Lac, France d Magwel NV, Martelarenplein 13, B-3000 Leuven, Belgium e CEA-LETI Minatec, 17 Rue des Martyrs, F38054 Crenoble, Cedex 9, France |
| Abstract: | Coplanar waveguide (CPW) and thin film microstrip (TFMS) lines integrating porous ultra low-k as inter-metal dielectric layers (k = 2.5) and copper as metal, are for the first time experimentally measured up to 110 GHz and under different temperature conditions, up to 200 °C. The extracted attenuation and propagation coefficients of those transmission lines are compared to simulations performed with MAGWEL software, a frequency domain 3-D Maxwell solver. Based on the characterization results some guidelines related to interconnect design are presented for future applications. |
| Keywords: | ULK Interconnects Propagation HF measurements Temperature behaviour 45 nm Node |
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