Thermosonic flip-chip bonding for SAW filter |
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Authors: | Taizo Tomioka Tomohiro Iguchi Ikuo Mori |
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Affiliation: | Corporate Manufacturing Engineering Center, TOSHIBA Corporation, Shin-isogo cho 33, Yokohama 235-0017, Japan |
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Abstract: | A flip-chip bonding (FCB) method suitable for the surface acoustic wave (SAW) filter was developed. In this method, the gold-ball bumps formed on the chip are directly bonded onto the ceramic substrate by thermosonic bonding. After FCB, they are sealed with a cap without using underfill resin. To obtain high bond strength, characteristic properties of the substrate electrode and the ball bump, were optimized. Furthermore, bondability has been improved by adopting a ramp-up loading profile. The reliability test was carried out with 6-pin SAW chips, and we confirmed the sufficient reliability of bonds. |
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