| Ni对Sn-0.7Cu焊料微观组织和力学性能的影响 |
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| 引用本文： | 王大勇,顾小龙.Ni对Sn-0.7Cu焊料微观组织和力学性能的影响[J].电子工艺技术,2007,28(1):17-19. |
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| 作者姓名： | 王大勇 顾小龙 |
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| 作者单位： | 浙江省冶金研究院亚通电子有限公司,浙江,杭州,310021;浙江省冶金研究院亚通电子有限公司,浙江,杭州,310021 |
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| 摘 要： | 研究了添加微量Ni元素对Sn-0.7Cu焊料的力学性能、微观组织和断裂特性的影响.结果表明,微量的Ni可已细化焊料合金的微观组织,显著提高焊料的塑性,从而提高焊料的综合力学性能;但Ni含量太高,焊料的塑性反而受到弱化,合适的Ni添加量为0.133%,此时焊料的拉伸强度为35.7 MPa,延伸率为50%.
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| 关 键 词： | 无铅焊料 微观组织 力学性能 |
| 文章编号： | 1001-3474（2007）01-0017-03 |
| 修稿时间： | 2006-11-18 |
Effect of Ni on the Microstructures and Mechanical Properties of Sn- 0.7Cu Lead- free Solder |
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| WANG Da-yong,GU Xiao-long.Effect of Ni on the Microstructures and Mechanical Properties of Sn- 0.7Cu Lead- free Solder[J].Electronics Process Technology,2007,28(1):17-19. |
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| Authors: | WANG Da-yong GU Xiao-long |
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| Affiliation: | Asia General Electronics CO. , LTD of Zhejiang Metallurgical Research Institute, Hangzhou 310021, China |
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| Abstract: | The research explores the effect of Ni element on the mechanical properties and microstructures and fracture models of Sn -0.7Cu solder. The results shows that Ni can fine solder microstructures, and contribute to improve solder plastic. However, solder plastic will be impaired if adding excess Ni into the solder. The optimal Ni content is 0. 133% ,at which the tensile strength and elongation of solder is 35.7 MPa and 50%, respectively. |
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| Keywords: | Lead - free solder Microstructure Mechanical properties |
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