无铅波峰焊接设备特点

相对于传统的Sn—Pb焊料，无铅焊料需要较高的焊接温度，而且润湿性差，另外免清洗助焊剂和水溶性助焊剂的固体含量低，活性温度高和活性区间窄。无铅焊料和助焊剂的特性决定了无铅波峰焊设备在结构和材料选用上有很大不同。本文通过对无铅波峰焊设备的各个部分的特点进行分析，为传统的旧波峰焊设备的改造提供参考。

Lead-free Wave Soldering Equipment Characteristic

Lead-free solder alloys are higher soldering temperatures and poorer wettabilities to traditional Sn-Pb solder alloys. No clean fluxes and water soluble fluxes are lower solids content, higher active temperatures and narrower active temperature districts to rosin fluxes. Structures and materials used in lead-free wave soldering equipments were different from traditional wave soldering equipments due to characteristic of lead-free solders and fluxes. In this paper the characteristic of lead-free wave soldering equipments were analyzed to provide references of traditional older wave soldering equipments reconstruction.