聚合物微流控芯片微通道模压成型分析

通过试验研究了聚合物微流控芯片微通道模压的工艺过程和工艺参数(包括模压温度、模压压力、模压时间、不同材料及卸载温度等)对微通道尺寸的影响。建立了模压工艺参数与微通道尺寸的关系,并基于黏弹性模型利用有限元方法进行了模压过程的数值仿真,仿真结果与试验结果基本吻合。本文的研究结果对完善聚合物微流控芯片设计和制作的基本理论和基本技术具有积极意义。

Hot embossing process analysis of microchannels for polymer microfluidic chips

A polymer micro hot embossing process was characterized by the experiments and numerical simulations. A series of experiments were carried out with varied process conditions, including processing pressure, temperature, time, different materials and unload temperature, both the depth and width of hot-embossed microchannel was investigated. Furthermore, the hot-embossing process was numerically simulated by the finite element method using a viscoelastic model to understand its mechanism. The simulation results show in satisfactory agreement with the related experiments, being significant for improvement of the basic theories and the practical techniques of the structure design and manufacture of the polymer microfluidic chips.