| 封装中无铅焊锡与不锈钢及铁镍的界面反应 |
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| 引用本文： | 颜怡文,刘为开. 封装中无铅焊锡与不锈钢及铁镍的界面反应[J]. 电子与封装, 2010, 10(6): 1-5,11 |
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| 作者姓名： | 颜怡文 刘为开 |
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| 作者单位： | 台湾科技大学高分子工程系,台北,106;龙华科技大学化学与材料工程学系,台湾,桃园,333 |
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| 摘 要： | 文章介绍了Sn、Sn-3.0Ag-0.5Cu(SAC)、Sn-0.7Cu(SC)、Sn-9Zn(SZ)、Sn-58Bi(SB)等五种无铅焊锡与金/镍/不锈钢(Au/Ni/SUS304)与铁-42wt%Ni(Alloy42)基材的界面反应。在不锈钢基材方面:与Sn反应仅生成Ni3Sn4相,与SAC反应初期生成Ni3Sn4相。随反应时间增长则生成(Cu,Ni)6Sn5相且剥离界面;另于界面处则有FeSn2相生成。与SC反应则生成层状(Cu,Ni)6Sn5相,随反应延长产生大规模剥离,并在界面生成FeSn2相。仅有Ni5Zn21相生成于SZ/Au//Ni/SUS304系统。SB/Au//Ni/SUS304系统也仅有Ni3Sn4相生成。在Alloy42基材方面:与纯Sn的界面反应仅生成FeSn2相。SAC焊锡与Alloy42基材反应生成(Fe,Ni,Cu)Sn2相,随反应时间延长该相形态变成连续及块状两层结构。在SC/Alloy42反应系统中仅观察到FeSn2相的生成。仅有(Ni,Fe)5Zn21层生成于SZ/Alloy42系统。与SC/Alloy42系统相似,与SB/Alloy42系统只有FeSn2相的生成,并无其他介金属相的生成。
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| 关 键 词： | 无铅焊锡 Au/Ni/SUS 304 Alloy 42 界面反应 剥离 介金属相 |
Interfacial Reactions in Lead-free Solders with Au/Ni/SUS 304 and Alloy 42 in Microelectronic Packaging |
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| YAN Yi-wen,LIU Wei-kai. Interfacial Reactions in Lead-free Solders with Au/Ni/SUS 304 and Alloy 42 in Microelectronic Packaging[J]. Electronics & Packaging, 2010, 10(6): 1-5,11 |
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| Authors: | YAN Yi-wen LIU Wei-kai |
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| Affiliation: | YAN Yi-wen1,LIU Wei-kai2 (1.Department of Polymer Engineering & Graduate Institute of Engineering,National Taiwan University of Science and Technology,Taibei 106,China,2.Department of Chemical and Materials Engineering,Lunghwa University of Science and Technology,Taoyuan 333,China) |
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| Abstract: | The interfacial reactions in Sn,Sn-3.0Ag-0.5Cu(SAC),Sn-0.7Cu(SC),Sn-9Zn(SZ),and Sn-58Bi (SB) lead-free solders with Au//Ni/SUS 304 and Fe-42wt%N(i Alloy 42) substrates are systemically reported in this article.In the Solder/Au//Ni/SUS 304 sections:Only the Ni3Sn4 phase was formed in the Sn/Au/Ni/SUS 304 system.In the SAC/Au/Ni/SUS 304 system,the Ni3Sn4 phase was formed at the initial stage;when the reaction time was increased,the(Cu,Ni)6Sn5 and FeSn2 phases were formed.Meanwhile,the massive spalling of the(... |
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| Keywords: | Au/Ni/SUS 304 Alloy 42 |
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