| 金属化层表面状况的不同处理方法对陶瓷金属封接强度的影响 |
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| 引用本文： | 张振霞,李秀霞,韩勇,林毅.金属化层表面状况的不同处理方法对陶瓷金属封接强度的影响[J].真空电子技术,2011(4):42-45,59. |
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| 作者姓名： | 张振霞 李秀霞 韩勇 林毅 |
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| 作者单位： | 中国科学院电子学研究所中国科学院高功率微波源与技术重点实验室,北京,100190 |
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| 摘 要： | 针对陶瓷金属封接,分别采取了打磨法和酸洗法两种不同的方法对陶瓷金属化层的表面状况进行处理,得到了两种不同的表面状态。利用划痕测试法,分析比较了两种方法制备试验件表面的电镀镍层的结合力情况。进行抗拉实验,研究比较了采用两种不同方法处理后的陶瓷抗拉试验件的封接强度。研究表明,酸洗法对金属化陶瓷表面的处理可以使金属化层得到更为良好的表面状态,是一种可以提高陶瓷金属封接强度的有效可行的方法。
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| 关 键 词： | 陶瓷金属封接 金属化层 表面状态：结合力 封接强度 |
Influence of Different Surface Proceeding Methods of the Metallization Layer on the Ceramic-Metal Sealing Intensity |
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| ZHANG Zhen-xia,LI Xiu-xia,HAN Yong,LIN Yi.Influence of Different Surface Proceeding Methods of the Metallization Layer on the Ceramic-Metal Sealing Intensity[J].Vacuum Electronics,2011(4):42-45,59. |
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| Authors: | ZHANG Zhen-xia LI Xiu-xia HAN Yong LIN Yi |
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| Affiliation: | ZHANG Zhen-xia,LI Xiu-xia,HAN Yong,LIN Yi (Key Laboratory of High Power Microwave Sources and Technologies,Institute of Electronics,Chinese Academy of Sciences,Beijing 100190,China) |
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| Abstract: | Two surface proceeding methods,the polishing method and the pickling method,have employed to treat the surface state of the ceramic metallization layer.The binding forces of the electrodeposited nickel layer treated with different proceeding methods have been analyzed and compared by scratch test.Several tensile tests have been performed to study the sealing intensity of the ceramic tensile test piece treated with different proceeding methods.The results show that better metallization surface state could be... |
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| Keywords: | Ceramic-metal sealing Metallization layer Surface state Binding force Sealing intensity |
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