| 通过控制LTCC多层基板收缩率消除通孔与导带间的开路失效 |
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| 引用本文： | 何小琦,马鑫,章瑜.通过控制LTCC多层基板收缩率消除通孔与导带间的开路失效[J].电子产品可靠性与环境试验,2002(3):4-8. |
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| 作者姓名： | 何小琦 马鑫 章瑜 |
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| 作者单位： | 1. 信息产业部电子第五研究所,广东,广州,510610
2. 信息产业部电子第四十三所研究所,安徽,合肥,230022 |
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| 摘 要： | LTCC基板的失效分析表明，通孔与导带间开路是多层基板布线互连失效的主要模式，原因是基板在共烧工艺过程中，布线金属与陶瓷材料收缩失配产生的界面应力导致布线开路。调整布线金属和陶瓷材料的致密化温度和基板收缩率后，有效控制了两种不同材料的界面收缩失配，消除了开路失效。
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| 关 键 词： | 低温共烧多层陶瓷基板 收缩率 开路失效 烧结工艺 |
| 修稿时间： | 2002年1月7日 |
Elimination of Opens Failure Between Via Holes and Traces in LTCC Multilayer Substrate by Coherent Shrinkage |
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| HE Xiao - qi,MA Xin,ZHANG - yu.Elimination of Opens Failure Between Via Holes and Traces in LTCC Multilayer Substrate by Coherent Shrinkage[J].Electronic Product Reliability and Environmental Testing,2002(3):4-8. |
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| Authors: | HE Xiao - qi MA Xin ZHANG - yu |
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| Abstract: | The open failure between via holes and traces in LTCC substrate had been studied. This failure mode is the most important one in LTCC. The reason of resulting in this failure is the interfacial tension between traces metal and ceramics at co - fired processing. By means of coher ent shrinkage and soften point, the open failure had been eliminated effectively. |
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| Keywords: | LTCC shrinkage open failure |
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